A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
Abstract
This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging .
Details
- Organisation(s)
-
Institute of Continuum Mechanics
Institute of Photonics
- External Organisation(s)
-
Beijing University of Technology
Dalian University of Technology
Tongji University
Bauhaus-Universität Weimar
- Type
- Article
- Journal
- Engineering Analysis with Boundary Elements
- Volume
- 184
- ISSN
- 0955-7997
- Publication date
- 03.2026
- Publication status
- Published
- Peer reviewed
- Yes
- ASJC Scopus subject areas
- Analysis, General Engineering, Computational Mathematics, Applied Mathematics
- Electronic version(s)
-
https://doi.org/10.1016/j.enganabound.2026.106640 (Access:
Closed
)
https://doi.org/10.48550/arXiv.2511.09348 (Access: Open )
